Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.
This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film.
The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.
According to the new market research report “Global ABF Substrate (FC-BGA) Market Report 2023-2029”, published by QYResearch, the global ABF Substrate (FC-BGA) market size is projected to reach USD 6.88 billion by 2029, at a CAGR of 5.6% during the forecast period.
Figure. Global ABF Substrate (FC-BGA) Market Size (US$ Million), 2018-2029
Figure. Global ABF Substrate (FC-BGA) Top 14 Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
The global key manufacturers of ABF Substrate (FC-BGA) include Unimicron, AT&S, Nan Ya PCB, Shinko Electric Industries, Ibiden, Kinsus Interconnect, Semco, Kyocera, Daeduck Electronics, TOPPAN, etc. In 2022, the global top five players had a share approximately 69.0% in terms of revenue.
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