Au-Sn solder paste is generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require a high tensile strength and high corrosive resistance, or in step soldering applications where the paste will not melt during a subsequent low-temperature reflow process.
According to the new market research report “Global Au-Sn Solder Paste Market Report 2023-2029”, published by QYResearch, the global Au-Sn Solder Paste market size is projected to reach USD 0.06 billion by 2029, at a CAGR of 1.7% during the forecast period.
Figure. Global Au-Sn Solder Paste Market Size (US$ Million), 2018-2029
Figure. Global Au-Sn Solder Paste Top 6 Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
The global key manufacturers of Au-Sn Solder Paste include Mitsubishi Materials, Indium Corporation, etc. In 2022, the global top three players had a share approximately 80.0% in terms of revenue.
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