Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where many IC's can be stacked together using suitable interconnect processes (like TSV or metal bumps) followed by encapsulation. Advanced Packaging Inspection Systems is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control through multi-mode optics and sensors and advanced defect detection algorithms. This report studies the Advanced Packaging Inspection Systems market.
According to the new market research report “Global Advanced Packaging Inspection Systems Market Report 2023-2029”, published by QYResearch, the global Advanced Packaging Inspection Systems market size is projected to reach USD 0.79 billion by 2029, at a CAGR of 9.0% during the forecast period.
Figure. Global Advanced Packaging Inspection Systems Market Size (US$ Million), 2018-2029
Figure. Global Advanced Packaging Inspection Systems Top 6 Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
The global key manufacturers of Advanced Packaging Inspection Systems include KLA, Onto Innovation, etc.
In 2022, the global top three players had a share approximately 52.0% in terms of revenue.
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