The diamond dicing blades without hub is a kind of ultra-thin and precision ultra thin diamond blade with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc
Performance of Dicing Blades Without Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of Wafer Dicing Blade Without Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
Specifications of Dicing Blades Without Hub
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Product Specification |
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Available shape |
1A8 |
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Working Condition |
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Grinding Type |
Wet |
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