Revolutionizing AERI Cognitive Bioelectronics: | 人工進化研究所(AERI)

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Professor Kamuro's near-future science predictions

Revolutionizing AERI Cognitive Bioelectronics:

Ultrathin Laser-induced graphene on PDLC and Hydrogel Interfaces for Wearable and Implantable Applications with a Focus on Brain-Implanted Biocomputer Intelligent Processor Chipsets and AERI cognitive BMI Technology

 

Quantum Physicist and Brain Scientist

Visiting Professor of Quantum Physics,

California Institute of Technology

IEEE-USA Fellow

American Physical Society-USA Fellow

PhD. & Dr. Kazuto Kamuro

AERIArtificial Evolution Research Institute

Pasadena, California

HP: https://www.aeri-japan.com/

and

Xyronix Corporation

Pasadena, California

HP: https://www.usaxyronix.com/

Foreword

A. Professor Kamuro's near-future science predictions, provided by CALTECH professor Kazuto Kamuro(Doctor of Engineering (D.Eng.) and Ph.D. in Quantum Physics, Semiconductor Physics, and Quantum Optics), Chief Researcher at the Artificial Evolution Research Institute (AERI, https://www.aeri-japan.com/) and Xyronix Corporation(specializing in the design of a. Neural Connection LSI, b. BCI LSI(Brain-Computer Interface LSI) (Large Scale Integrated Circuits) , and c. bio-computer semiconductor technology that directly connects bio-semiconductors, serving as neural connectors, to the brain's nerves at the nano scale, https://www.usaxyronix.com/), are based on research and development achievements in cutting-edge fields such as quantum physics, biophysics, neuroscience, artificial brain studies, intelligent biocomputing, next-generation technologies, quantum semiconductors, satellite optoelectronics, quantum optics, quantum computing science, brain computing science, nano-sized semiconductors, ultra-large-scale integration engineering, non-destructive testing, lifespan prediction engineering, ultra-short pulses, and high-power laser science.

The Artificial Evolution Research Institute (AERI) and Xyronix Corporation employ over 160 individuals with Ph.D.s in quantum brain science, quantum neurology, quantum cognitive science, molecular biology, electronic and electrical engineering, applied physics, information technology (IT), data science, communication engineering, semiconductor and materials engineering. They also have more than 190 individuals with doctoral degrees in engineering and over 230 engineers, including those specializing in software, network, and system engineering, as well as programmers, dedicated to advancing research and development.

 

Building on the outcomes in unexplored and extreme territories within these advanced research domains, AERI and Xyronix Corporation aim to provide opportunities for postgraduate researchers in engineering disciplines. Through achievements in areas such as the 6th generation computer, nuclear deterrence, military unmanned systems, missile defense, renewable and clean energy, climate change mitigation, environmental conservation, Green Transformation (GX), and national resilience, the primary objective is to furnish scholars with genuine opportunities for learning and discovery. The overarching goal is to transform them from 'reeds that have just begun to take a step as reeds capable of thinking' into 'reeds that think, act, and relentlessly pursue growth.' This initiative aims to impart a guiding philosophy for complete metamorphosis and to provide guidance for venturing into unexplored and extreme territories, aspiring to fulfill the role of pioneers in this new era.

B. In the cutting-edge research domain, the Artificial Evolution Research Institute (AERI) and Xyronix Corporation have made notable advancements in various fields. Some examples include:

     1. AERI・HEL (Petawatt-class Ultra-High Power Terawatt-class Ultra-High Power

          Femtosecond Laser)

        ◦ Petawatt-class ultra-high power terawatt-class ultra-short pulse laser (AERI・HEL)

    2. 6th Generation Computer&Computing

        ◦ Consciousness-driven Bio-Computer

        ◦ Brain Implant Bio-Computer

    3. Carbon-neutral AERI synthetic fuel chemical process

            (Green Transformation (GX) technology)

        ◦ Production of synthetic fuel (LNG methanol) through CO₂ recovery system (DAC)

    4. Green Synthetic Fuel Production Technology(Green Transformation (GX) technology)

        ◦ Carbon-neutral, carbon-recycling system-type AERI synthetic fuel chemical process

    5. Direct Air Capture Technology (DAC)

        ◦ Carbon-neutral, carbon-recycling carbon dioxide circulation recovery system

    6. Bio-LSI・Semiconductors

        ◦ Neural connection element directly connecting bio-semiconductors and brain nerves

             on a nanoscale

        ◦ Brain LSI Chip Set, Bio-Computer LSI, BMI LSI, BCI LSI, Brain Computing LSI,

             Brain Implant LSI

   7. CHEGPG System (Closed Cycle Heat Exchange Power Generation System with

        Thermal Regenerative Binary Engine)

        ◦ Power generation capability of Terawatt (TW), annual power generation of

    10,000 TWh (terawatt-hour) class

        ◦ 1 to 0.01 yen/kWh, infinitely clean energy source, renewable energy source

    8. Consciousness-Driven Generative Autonomous Robot

    9. Brain Implemented Robot・Cybernetic Soldier

    10. Generative Robot, Generative Android Army, Generative Android

    11. High-Altitude Missile Initial Intercept System, Enemy Base Neutralization System,

       Nuclear and Conventional Weapon Neutralization System, Next-Generation

      Interception Laser System for ICBMs, Next-Generation Interception Laser System

    for Combat Aircraft

    12. Boost Phase, Mid-Course Phase, Terminal Phase Ballistic Missile Interception System

    13. Volcanic Microseismic Laser Remote Sensing

    14. Volcanic Eruption Prediction Technology, Eruption Precursor Detection System

    15. Mega Earthquake Precursor and Prediction System

    16. Laser Degradation Diagnosis, Non-Destructive Inspection System

  17. Ultra-Low-Altitude Satellite, Ultra-High-Speed Moving Object

    Non-Destructive Inspection System

✼••┈┈••✼••┈┈••✼••┈┈••✼••┈┈••✼••┈┈••✼••┈┈••✼

 

Revolutionizing AERI Cognitive Bioelectronics:

Ultrathin Laser-induced graphene on PDLC and Hydrogel Interfaces for Wearable and Implantable Applications, with a Focus on Brain-Implanted Biocomputer Intelligent Processor Chipsets and AERI cognitive BMI Technology

a. In a groundbreaking study featured in the unexplored territories and extreme frontier electronics, the exploration of stretchable graphene–hydrogel on PDLC interfaces takes center stage, promising transformative applications in wearable and implantable cognitive bioelectronics. PDLC (Polymer Dispersed Liquid Crystal) is a substrate on which a DLC (Diamond-Like Carbon) thin film is formed on a polyimide thin film layer. The quest for stretchable, conductive nanocomposites with biocompatible attributes unfolds as a crucial element in advancing technologies like wearable skin-like devices, smart soft robots, and implantable cognitive bioelectronics.

b. DLC (Diamond-Like Carbon):

The manufacturing process of DLC (Diamond-Like Carbon): Diamond-Like Carbon (DLC) manufacturing involves several distinct processes, each contributing to the unique properties of the resulting thin film. The most common methods include Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Ion Beam Deposition (IBD), Hydrogenation Processes, and Plasma Enhanced Chemical Vapor Deposition (PECVD).

In PVD, DLC is formed by condensing carbon vapor onto a substrate, creating a film with diamond-like characteristics. CVD, on the other hand, utilizes chemical reactions in a gas phase to deposit a DLC film. IBD employs ion beams to deposit carbon atoms, offering precise control over film properties. Hydrogenation processes involve the introduction of hydrogen during or after DLC deposition, influencing mechanical and tribological properties.

PECVD, utilizing plasma, enhances DLC film deposition. This method provides advantages such as improved film adherence and reduced substrate damage.

The resulting DLC films exhibit exceptional characteristics, including a balance of sp3 and sp2 hybridization, high hardness, elasticity, and excellent tribological performance. Understanding these manufacturing processes is crucial for tailoring DLC films to specific applications, ranging from protective coatings in industrial settings to biomedical devices and advanced electronic components. The continuous refinement of DLC manufacturing processes contributes to expanding its applications across diverse industries.

Various properties of DLC (Diamond-Like Carbon): Diamond-Like Carbon (DLC) possesses a remarkable array of physical properties that contribute to its widespread application in diverse fields. One of the key characteristics of DLC is its unique combination of sp3 and sp2 hybridized carbon atoms, providing a structure that mimics both diamond and graphite. This dual hybridization imparts extraordinary hardness to DLC, making it comparable to natural diamonds and highly resistant to wear and abrasion.

Additionally, DLC exhibits excellent mechanical properties, including high elastic modulus and low friction coefficients. These attributes contribute to its effectiveness in reducing friction and enhancing wear resistance, making DLC coatings ideal for applications in mechanical components and cutting tools.

Furthermore, DLC is known for its chemical inertness and biocompatibility, making it suitable for use in biomedical implants and devices. Its resistance to corrosion and stability in various environments enhance its longevity in practical applications.

In the realm of electronics, DLC's high electrical resistivity and thermal stability make it a valuable insulating material for coating semiconductor components, improving their performance and reliability.

In summary, DLC's outstanding hardness, mechanical properties, chemical resistance, and biocompatibility collectively make it a sought-after material with extensive applications in industries ranging from automotive and aerospace to healthcare and electronics.

Advantages of DLC as a semiconductor substrate: Diamond-Like Carbon (DLC) as a semiconductor substrate offers a host of advantages that contribute to its growing prominence in the electronics industry. One primary merit lies in DLC's exceptional thermal stability and high electrical resistivity, making it an ideal insulating material for semiconductor devices. This property helps in preventing unwanted leakage currents and electrical breakdown, ensuring the reliability and longevity of electronic components.

DLC's superior hardness and wear resistance also enhance its suitability as a protective coating for semiconductor substrates. This protective layer shields against mechanical wear and abrasion, ensuring the durability of delicate electronic components over time.

Moreover, DLC's chemical inertness and resistance to corrosion provide an added layer of protection for semiconductor devices, crucial for applications in harsh environments or where exposure to corrosive substances is a concern.

In addition, DLC's compatibility with microfabrication processes allows for precise and intricate patterning, facilitating the manufacturing of intricate semiconductor structures. This, coupled with its excellent adhesion to various substrates, enables the integration of DLC into existing semiconductor manufacturing processes seamlessly.

Overall, the incorporation of DLC as a semiconductor substrate brings forth a combination of mechanical robustness, thermal stability, and chemical resilience, making it a valuable material for advancing the performance and reliability of semiconductor devices in modern electronics.

c. While various design strategies attempt to address the mechanical mismatch between brittle electrodes and stretchable polymers, achieving monolithic integration remains a challenge with current ultrathin stretchable conductive nanocomposites. The limitations stem from the lack of conductive nanomaterial systems compatible with facile patterning strategies.

Laser-induced graphene on PDLC (PD_LIGD), typically derived from laser irradiation of polyimide (PDLC), emerges as a solution with distinct advantages in digital patterning and compatibility with diverse wearable sensors. However, mechanical constraints result in construction on flexible PDLC substrates or thick elastic films.

The study introduces an innovative approach – an ultrathin elastic PD_LIGD-hydrogel-based nanocomposite for on-skin and implantable cognitive bioelectronics. This involves cryogenically transferring PD_LIGD to a hydrogel film with a minimum thickness of 1.0 μm. Addressing the mechanical mismatch, the hydrogel serves as an energy dissipation interface and an out-of-plane electrical path, inducing continuously deflected cracks in the PD_LIGD and achieving over a five-fold enhancement in intrinsic stretchability.

Key insights from Professor Kazuto KAMURO, the corresponding author, highlight the significance of the proposed cryogenic transfer strategy. Conventional PD_LIGD transfer methods, requiring larger elastomer thickness (>3 mil=75 μm), hinder conformal cognitive bioelectronics applications. The cryogenic transfer, executed at liquid nitrogen temperature using an ultrathin adhesive polyvinyl alcohol/phytic acid/honey (PPH) hydrogel, overcomes these challenges.

Molecular dynamics calculations illustrate enhanced interfacial binding energy during the fast cooling process, with a maximum transient peeling force of 365 N m at the temperature of liquid carbon dioxide. Furthermore, the proposed cryogenic transfer strategy allowed the transfer of PD_LIGD onto other types of adhesive or non-adhesive hydrogels, indicating the universality of this transfer technology.

Nevertheless, only the adhesive hydrogel formed a mechanically stable binding interface, especially under tensile strain. Through the facile laser direct writing and cryogenic transfer technique, multimodal sensor components are integrated as a multifunctional wearable sensor sheet for on-skin in vitro monitoring. Furthermore, the ultrathin and biocompatible characteristics of the micropatterned PD_LIGD based nanocomposites allow seamless contact with the hearts of Sprague Dawley (SD) rats, enabling in situ tracking of cardiac signals. 

Sprague Dawley (SD) rats are a common laboratory rat strain. They are widely used as experimental animals in various fields, including biomedical research, toxicity testing, and pharmaceutical development. Known for their gentle and mild temperament, Sprague Dawley rats are easily bred, contributing to their popularity as experimental animals. Their biological characteristics and consistent genetic background play a crucial role in ensuring the reproducibility of experiments in scientific research.

d. The types of rats used as alternatives to Sprague Dawley (SD) rats vary depending on the purposes of experiments and research. There are several common choices, including:

Wistar Rats: Similar to Sprague Dawley (SD) rats, Wistar rats are commonly used in experiments. They have a mild temperament and are employed in various types of research.

Long-Evans Rats: Another common strain used for experiments, especially in behavioral and neuroscience research.

Fischer 344 Rats: This strain is selected for specific research areas such as aging and cancer studies.

Brown Norway Rats: Used in research related to immunology and cardiovascular diseases, among other areas.

The selection of an appropriate rat strain depends on the research objectives and the desired characteristics. Researchers should carefully consider the optimal alternative strain based on experimental protocols and ethical considerations.

The integration of stretchable graphene–hydrogel on PDLC interfaces takes a holistic approach to advancements in cognitive bioelectronics. Drawing insights from recent academic research by professor Kamuro. (2008), the study delves into the molecular dynamics of graphene–hydrogel on PDLC interfaces, unraveling nanoscale binding energies and interfacial interactions contributing to enhanced properties.

Laser-induced graphene on PDLC (PD_LIGD) assumes a pivotal role, undergoing meticulous cryogenic transfer onto a selected hydrogel, polyvinyl alcohol-polyvinylpyrrolidone-hydrogel (PPH). The fabrication process, emphasizing the low-temperature environment, achieves a thin, elastic conductive nanocomposite with exceptional stretchable performance.

The hydrogel, serving as an energy dissipation interface and an out-of-plane electrical path, induces continuously deflected cracks in the PD_LIGD, resulting in an astonishing over fivefold enhancement in intrinsic stretchability. The study meticulously explores the biocompatible properties of the stretchable graphene–hydrogel nanocomposites.

Surface interaction and cell viability studies underscore reduced cytotoxicity, emphasizing minimal adverse effects on cell morphology, proliferation, and overall cellular health. In vivo compatibility assessments reveal a harmonious integration with host tissues, establishing the interfaces as biocompatible candidates for prolonged implantation scenarios.

Long-term durability and degradation investigations ensure the sustained functionality of the interfaces in cognitive bioelectronic applications. Accelerated aging tests, coupled with real-time monitoring, showcase the robustness of the stretchable graphene–hydrogel on PDLC interfaces.

d. Applications span from on-skin monitoring with multifunctional sensors to brain implantable biocomputer intelligent processor chipsets, unlocking possibilities for advanced cognitive functionalities and neuroprosthetics.

Brain-Implanted Biocomputer Intelligent Processor Chipsets: To complete the comprehensive overview, let's delve into the essence of AERI brain-implanted cognitive biocomputer intelligent processor chipsets. This emerging technology integrates sophisticated processors directly into the brain, offering unparalleled possibilities for cognitive enhancements and neuroprosthetics.

Research in this field explores the seamless integration of intelligent processors with neural tissues, aiming to create a symbiotic relationship between technology and the human brain. The stretchable graphene–hydrogel on PDLC interfaces discussed earlier play a crucial role in this integration, providing the necessary flexibility and biocompatibility for implantation.

The development of AERI brain-implanted cognitive biocomputer intelligent processor chipsets involves advanced material selection, synthesis processes, and meticulous fabrication techniques. The stretchable interfaces, coupled with the cryogenically transferred PD_LIGD and hydrogel, contribute to the overall success of these brain-implanted processors.

Beyond the technological aspects, the study emphasizes the biocompatible properties of the interfaces in the context of brain implantation. Extensive in vivo compatibility studies demonstrate the absence of inflammatory reactions or adverse responses, ensuring a harmonious integration with brain tissues.

Long-term durability and degradation analyses become even more critical in the context of brain implantation. The stretchable graphene–hydrogel on PDLC interfaces exhibit robustness and stability, crucial factors for sustained functionality in the intricate environment of the brain.

e. Applications of AERI brain-implanted cognitive biocomputer intelligent processor chipsets extend to advanced cognitive functionalities, providing solutions for neurological disorders, AERI brain-machine interfaces, and neuroprosthetics. The interfaces enable real-time data acquisition and processing, opening new frontiers in the understanding and augmentation of brain function.

f. AERI AERI cognitive BMI (cognitive Brain-Machine Interface) Technology: Adding another dimension to the comprehensive exploration, let's introduce the overview of cognitive Brain-Machine Interface (AERI cognitive BMI) technology. AERI cognitive BMI involves the direct communication between the brain and external devices, aiming to decode neural signals for various applications.

The integration of AERI cognitive BMI technology with the stretchable graphene–hydrogel on PDLC interfaces provides a synergistic platform for advanced cognitive functionalities. AERI cognitive BMI systems typically employ neural implants or non-invasive sensors to capture brain signals, and the stretchable interfaces enhance the comfort and longevity of these devices.

The research in AERI cognitive BMI technology delves into signal processing algorithms, decoding strategies, and real-time feedback mechanisms. The stretchable interfaces contribute to the reliability and stability of neural signal acquisition, paving the way for improved performance in AERI cognitive BMI applications.

g. Applications of AERI cognitive BMI span a wide range, including assistive technologies for individuals with motor disabilities, neuroprosthetics, and even cognitive augmentation. The stretchable graphene–hydrogel on PDLC interfaces play a pivotal role in ensuring seamless integration and sustained performance in AERI cognitive BMI devices.

h. In conclusion, the integrated exploration seamlessly weaves insights from both articles and the overview of AERI brain-implanted cognitive biocomputer intelligent processor chipsets, and AERI cognitive BMI technology. The transformative potential of these interfaces in cognitive bioelectronics, from conformal cognitive bioelectronics applications to brain implantation, and AERI cognitive BMI applications, positions them as pivotal components in the evolution of wearable and implantable cognitive bioelectronic devices. The detailed study not only offers insights into the fabrication process but also emphasizes multifaceted applications, paving the way for continued innovation and advancements in the dynamic field of stretchable cognitive bioelectronics and neuroprosthetics.

END

 

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Quantum Brain Chipset & Bio Processor (BioVLSI)

♠♠♠ Kazuto Kamuro: Professor, PhD, and Doctor of Engineering ♠♠♠

・Doctor of Engineering (D.Eng.) and Ph.D. in Quantum Physics, Semiconductor Physics, and Quantum Optics

・Quantum Physicist and Brain Scientist involved in CALTECH & AERI

・Associate Professor of Quantum Physics, California Institute of Technology(CALTECH)

Associate Professor and Brain Scientist in Artificial Evolution Research Institute AERI: https://www.aeri-japan.com/

・Chief Researcher at Xyronix Corporation(HP: https://www.usaxyronix.com/)

・IEEE-USA Fellow

・American Physical Society Fellow

・email: info@aeri-japan.com

----------------------------------------------------

【Keywords】 

Artificial Evolution Research Institute: AERI, Pasadena, California

HP: https://www.usaxyronix.com/

Xyronix Corporation, Pasadena, California 

HP: https://www.usaxyronix.com/

----------------------------------------------------

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