Submount (Heatspreader) Market Summary
According to the new market research report "Global Submount (Heatspreader) Market Report 2023-2029", published by QYResearch, the global Submount (Heatspreader) market size is projected to grow from USD 293 million in 2023 to USD 356 million by 2029, at a CAGR of 3.3% during the forecast period.
This report profiles key players of Submount (Heatspreader) such as Kyocera, MARUWA, Vishay, ALMT Corp, Murata, etc.
In 2022, the global top five Submount (Heatspreader) players account for 58.7% of market share in terms of revenue. Above figure shows the key players ranked by revenue in Submount (Heatspreader).
Market Drivers:
As electronic devices become more powerful and compact, there is a growing need for efficient thermal management solutions. Submounts play a crucial role in dissipating heat generated by electronic components, ensuring optimal performance and reliability.
Submounts are commonly used in LED applications and semiconductor devices. With the continued growth of the LED lighting industry and semiconductor technologies, the demand for effective thermal management solutions is expected to increase.
The development of power electronics for various applications, such as automotive, renewable energy, and consumer electronics, often requires effective thermal management solutions. Submounts can help in dissipating heat generated by power electronic components.
Restraint:
Submounts need to be compatible with various electronic components, materials, and manufacturing processes. Compatibility issues or the need for modifications to existing systems can act as a restraint, especially in industries where standardization is crucial.
Some materials used for submounts may have limitations in terms of thermal conductivity. If the chosen materials do not provide sufficient heat dissipation, it could be a restraint in meeting the thermal management requirements of high-performance electronic devices.
Opportunity:
The increasing demand for high-performance electronic devices, especially in applications such as data centers, telecommunications, and automotive electronics, creates opportunities for innovative submount solutions that enhance thermal management.
The rollout and expansion of 5G networks drive the need for advanced electronic components with efficient thermal management. Submounts that can handle the heat generated by 5G-related technologies present opportunities in this growing market.
The trend toward smaller and more compact electronic devices creates opportunities for submount solutions that can effectively dissipate heat in confined spaces without compromising performance.
About The Authors
Gao Jinjie – the main analyst of this article
Email: gaojinjie@qyresearch.com
Mr. Gao has 3 years of industry research experience and focuses on research in related fields of medical and consumer goods industry chains, including health products, medical services, medical drugs, etc. Some research topics include biomedical research, semiconductor industry, test robots, mechanical equipment, electronic components, etc.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 16 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.