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Summary: The semiconductor industry is facing its own cliff. Moore's Law scaling has slowed down and the basic recipe that has served the industry for so long will reach the end of the road at 20nm. The theme of IEDM, an annual chip conference earlier this week, was what happens next.
The chip industry is facing its own sort of cliff at 20 nanometers. What happens beyond that was the theme of the IEEE's 2012 International Electron Devices Meeting, which took place this week in San Francisco.
To some extent this is what IEDM has always been about. The end of Moore's Law has been predicted many times but the industry always finds a way forward. Intel confirmed it was using new materials--a high-k insulator and metal gates--at IEDM in 2007 with battery such as Sony ACC25 Ac Adapter, Sony VGN-FZ Ac Adapter, Sony PCG-FR Ac Adapter, Sony VGN-CR Ac Adapter, Sony PCGA-AC51 Ac Adapter, Sony PCG-V505 Ac Adapter, Sony VGN-B1VP Ac Adapter, Sony PCG-Z1RA Ac Adapter, Sony VGN-TX Ac Adapter, Sony VGN-U8 Ac Adapter, Sony VGN-X505 Ac Adapter, Sony VGN-TX690 Ac Adapter, and the rest of the industry eventually followed.
But this year felt a bit different for two reasons. First, it seems clear that Moore's Law scaling has slowed down and the basic recipe that has served the industry for so long--planar CMOS transistors on silicon wafers--really has reached the end of the road at 20nm. On that nearly everyone agrees. Second, there are still many alternatives on the table, which made this year's conference very interesting.
The front-runner is the 3D transistor or FinFET. Unlike conventional planar transistors which have a channel on the surface of the wafer and a gate on top, FinFETs have a channel that sticks up like a fin (hence the name) with a gate that wraps all the way around it for better control. Intel was the first to introduce FinFETs (the company calls them "tri-gate transistors") with its 22nm Ivy Bridge Core processors, which began shipping nearly a year ago.
The leading-edge foundries, which are currently manufacturing 28nm chips, are sticking with planar bulk CMOS through the 20nm generation, though it is unlikely to provide the same benefits as previous shrinks. After that the foundries will shift to FinFETs. In October TSMC announced that it would introduce FinFETs on a 16nm node by the end of next year followed by a 10nm node with FinFETs in early production at the end of 2015.
GlobalFoundries, which had previously said it will start production of chip with 14nm FinFETs in 2014, revealed a new roadmap at IEDM. The foundry, which manufactures most of AMD's processors, also plans to deliver 10nm in 2015 and 7nm in 2017 using FinFETs.